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Circuit Break – A MacroFab Podcast

EP#143: System-In-Package Platforms

48 min • 24 oktober 2018
  • Gene Frantz - Chief Technology Officer for Octavo Systems
    • One of the founders and the visionary behind Octavo Systems
    • Professor in the Practice at Rice University in the Electrical and Computer Engineering Department
    • Was the Principal Technology Fellow at Texas Instruments where he built a career finding new opportunities and building new businesses to leverage TI’s DSP technology
    • Holds 48 patents and has written over 100 papers/articles and presents at conferences around the globe
    • Has a BSEE from the University of Central Florida, a MSEE from Southern Methodist University, and a MBA from Texas Tech University
  • Erik Welsh - Applications and Systems Manager for Octavo Systems
    • Has over 16 years of industry experience designing hardware and software systems, including 11 years at Texas Instruments
    • Supported hundreds of developers bringing embedded systems quickly to market
    • Simplifying complex systems is a passion and mentors engineers developing embedded Linux systems
    • Developed platforms for cutting-edge wireless research to provide open-access to startups
    • Began his career as a SoC (System-On-Chip) designer eventually leading SoC Security Architecture development
    • Currently holds multiple patents in the area of System-in-Package technology
    • Has a Bachelor of Science and Masters in Electrical Engineering from Rice University
  • Octavo Systems

Tags: electronics podcast, Erik Welsh, Gene Frantz, MacroFab, macrofab engineering podcast, MEP, Octavo Systems, OSD335X C-SIP, System on Chip, System-in-Package

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