The Cutting Edge of Integrated Circuits: Exploding Chips, How Meta's Stacking It Up For AR, and More

IEEE Spectrum's semiconductor expert, Samuel K. Moore, talks with Stephen Cass about his visit to one of the key conferences in emerging integrated circuit technology, ISSCC. We talk about Meta's new 3D chip-stacking tech for faster AR, faster AI through in-memory computation, and security technology that can cause a chip to self-destruct if anyone tries to hack it.